In the new electrical grids, series/parallel converters architectures can be considered for medium and high voltage power conversion. Dual Active Bridge (DAB) topology is a serious candidate to be implemented within these converters.
In the future, medium-frequency transformers (with a frequency range of 5-100 kHz) will be major components in dc-dc converter applications, for both medium-voltage direct current and high-voltage direct current networks.
High Voltage Direct Current (HVDC) is increasingly being used for electric power transmission over long distances.
Gate-drive power supplies in medium voltage and high voltage direct current (MVDC / HVDC) applications require medium to high voltage insulation.
With the development of wide bandgap semiconductors, voltage ratings of 10kV and more become realistic. As a consequence, it is now mandatory to propose a suitable packaging. Ceramic-metal substrates are an established technology for voltages up to 3.3kV, but they exhibit some weaknesses for higher voltages.
The failure mode of press-pack-type packages dedicated to SiC devices is experimentally analyzed in order to investigate their use for HVDC applications. Single SiC Schottky diode samples have been submitted to short-circuit conditions and continuous current flow test.
The article describes a feedback Preisach hysteresis model equivalent circuit implementation of a medium frequency single-phase transformer being a part of a high power and high efficiency DC-DC converter.
This paper presents the experimental evaluation of SiC MOSFETs from different manufacturers operated in avalanche.
High Voltage Direct Current (HVDC) converters are composed of hundreds of semiconductor switches connected in series to sustain the rated voltage of the converter (several hundred of kilovolts). Because of the large number of switches, it is highly probable that at least one of them will fail during the lifetime of the converter. Such failure should not cause the entire converter to shut down, despite the series connexion of the switches. As a consequence, each switch should be designed so that upon failure, it becomes a short circuit and keeps carrying the current (“fail-to-short” behaviour).
High Voltage Direct Current (HVDC) converters are composed of hundreds of semiconductor switches connected in series to sustain the rated voltage of the converter (several hundred of kilovolts). Because of the large number of switches, it is highly probable that at least one of them will fail during the lifetime of the converter. Such failure should not cause the entire converter to shut down, despite the series connexion of the switches. As a consequence, each switch should be designed so that upon failure, it becomes a short circuit and keeps carrying the current (“fail-to-short” behaviour).
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