Protruding Ceramic Substrates for High-Voltage Packaging of Wide-Bandgap Semiconductors

2021-08-11T17:14:59+02:00September 13th, 2017|Electronique de puissance & convertisseurs, Publications|

With the development of wide bandgap semiconductors, voltage ratings of 10kV and more become realistic. As a consequence, it is now mandatory to propose a suitable packaging. Ceramic-metal substrates are an established technology for voltages up to 3.3kV, but they exhibit some weaknesses for higher voltages.

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