Abstract

Recent advances in wide band-gap semiconductors technologies enable an increase in the power density of converters. The advantages of silicon carbide (SiC) sevices are well documented and packaging solutions for high voltage components (6.5 – 10 kV) are available. However, when insulation coordination constraints are considered, isolation distances become a major issue, as they result in larger packages. In this paper, we describe and demonstrate a simple solution which allows to extend the capability of a standard power module package to higher voltages.

Hugo Reynes, Eric Vagnon, Cyril Buttay, Martin Guillet

Presented at PCIM 2022